Cutting semiconductor materials thinly - Laser Slicing -
Keywords: Precision microfabrication, abrasive processing, laser processing, semiconductor crystal materials, glass.
Semiconductors are incorporated into everything from smartphones to electric vehicles and AI, but as our lives become richer, global warming continues to progress. This is where next-generation power semiconductor materials are gaining attention. Compared to conventional materials, they are ideal materials with high efficiency and durability, but they are extremely difficult to process, with processing costs being tens to thousands of times higher. In response, our research laboratory has developed laser slicing technology. By transmitting laser light through the material, we utilize the heat generated to form countless microscopic cracks. By creating a fine chain of these cracks, we have developed a technique to slice the material thinly. In our previous research, we have successfully sliced various materials, achieving reductions in processing time and material loss that surpass conventional technologies. Once the material is set, it can be cut instantly without sound or vibration. We aim to achieve a processing technology that is truly like magic.
- Company：埼玉大学 オープンイノベーションセンター
- Price：Other
